Wafer cleaving is a process that gets carried out in nano fabrication facilities since the wafers ideally require a clean production environment during manufacture. The benefits of a cleaving tool are plenty and revolutionizing.
Nano fab users get to utilize a single wafer to carry out multiple experiments as opposed to using multiple resources for one minor analysis. Cleaving is also the ideal means by which particle contamination is the least and so is material destruction.
However, a wafer cleaving tool is not exempted from producing particles that contribute to the sample and clean room contamination.
Wafer cleaving challenges
The general procedure of cleaving by hand involves scribing and then manual breaking by leveraging against pin-pointed weight. It is a highly inaccurate and inefficient procedure in which to invest but has been carried out for many decades now.
The challenge lies in obtaining work samples free from contamination without compromising on the overall clean room hygiene. Further, the ideal sample preparation approach will ensure greatly reduced material wastage or adulteration.
Quality equipment for quality cleaving
The best wafer cleaving tool determines the quality of the material and the accuracy of experiments conducted on various electronic substrates.
LatticeGear offers cutting-edge technology in the realm of wafer cleaving benchtop equipment to ensure professional-grade products. The cleaving tools efficiently cut down on particle contamination while effectively cleaving, downsizing, and singulating the entire material.
Furthermore, the equipment is ideally compatible with the clean room environment, industrially proven to be a cost-effective and efficient solution.
Traditional methods of cleaving, with hand-held tools, are time-consuming with room for imperfection, material damage, and overall reduced die quality. Uneven cuts are a common occurrence.
In stark contrast, the seemingly effortless wafer cuts produced by LatticeGear cleaving equipment are fast, precise, and clean, consistently so. There is reduced resource wastage as well as time conservation and efficient business production.
What you can expect from the best wafer cleaving tool?
The cleaving technology available at Lattice Gear is designed to make short work of multiple electronic wafer substrates, be they amorphous or crystalline.
Setting benchmark standards is the LatticeAx 420 by LatticeGear, forming the epitome of industrial precision equipment. The accuracy furnished by the LatticeAx is a direct result of the presence of an XY stage and microscope that cleaves even the smallest of wafers.
It is the small-sized samples that pose a higher degree of challenge in cleaving than the material type or thickness.
The many benefits and features of LatticeAx 420
A crucial feature of the LatticeAx is its scribeless ability of cleaving. The only point of contact before the final cleave is a simple indent made on the material edge. Thus, there are comparatively fewer chances of particle or die contamination coupled with timely sample processing.
Another noteworthy feature would be the dual ability of weak point creation and cleaving undertaken as a single step. This measure, again, ensures drastically reduced levels of contamination as well as cleanroom maintenance and decontamination costs.
The dedicated cleaving workstation of the LatticeAx allows quick adjustments from initial material surveying to final sample inspections. Furthermore, the equipment accommodates various samples ranging in different sizes and thicknesses, from GaAs, silicon, sapphire, InP, glass, and more.
Here is a quick peek at the LatticeAx features in detail.
- Target positioning accuracy (∓10 µm)
- Fine and coarse focus control with focus mount
- Positional indent control (5 µm step size)
- Indent calibration clock-dial
- LatticeGear custom build
- Diamond tip indenter
- Color CCD Camera with a parfocal, monocular, zoom lens (.58-7x mag)
- Quick and simple sample processing setup
Cleaving experiments indicate that cost and time-cycle reduction coupled with the best-suited processes is key to creating innovative products and materials. In this regard, the LatticeAx enables streamlining the entire workflow by enhancing something as basic as wafer sample preparation.
Affordability and Quality with every Wafer cleaving equipment
Convenience is the perfect emotion guaranteed with every purchase made at LatticeGear. Whether it is the LatticeAx 420 or any other cleaving tool, LatticeGear furnishes the industry-best technology to accomplish cleaving with effortless ease.
The low ownership cost is another appealing factor besides the obvious work quality. Indulge in fewer equipment hassles and low production costs by reaching out to the professionals at LatticeGear at 503-828-0040 for further inquiries.